Zoom inZoom out

NVL11708: The record date for bond interest payment

HOSE announces the record date for the 1st bond interest payment by No Va Land Investment Group Corporation as follows:

-   Issuer                   : No Va Land Investment Group Corporation

-   Bond name         : NVLG022019 Bond

-   Bond symbol       : NVL11708

-   ISIN code             : VN0NVL117083

-   Bond type                        : coporate bond

-   Par value             : VND100,000

-   Ex-right date       : August 14, 2017

-   Record date        : August 14, 2017

-   Reason & purpose        : to made the first bond interest payment (From and inclusive of the date of February 28, 2017 to and exclusive of the date of August 28, 2017 of NVL11708 bond)

-   Interest rate         : 10.9%/year

-   Payment amount           : VND5,480.278 for 01 bond

-   Payment date     : August 28, 2017

-   Place of payment:

  • Bondholders whose bonds have been deposited: at the securities firms where the bonds have been deposited.
  • Bondholders whose bonds have not been deposited: at Techcom Securities Company Limited on August 28, 2017. 

HOSE

 

 

Show email

Enter the number:    =   

  

NVL11708: The record date for bond interest payment

HOSE announces the record date for the 1st bond interest payment by No Va Land Investment Group Corporation as follows:

-   Issuer                   : No Va Land Investment Group Corporation

-   Bond name         : NVLG022019 Bond

-   Bond symbol       : NVL11708

-   ISIN code             : VN0NVL117083

-   Bond type                        : coporate bond

-   Par value             : VND100,000

-   Ex-right date       : August 14, 2017

-   Record date        : August 14, 2017

-   Reason & purpose        : to made the first bond interest payment (From and inclusive of the date of February 28, 2017 to and exclusive of the date of August 28, 2017 of NVL11708 bond)

-   Interest rate         : 10.9%/year

-   Payment amount           : VND5,480.278 for 01 bond

-   Payment date     : August 28, 2017

-   Place of payment:

  • Bondholders whose bonds have been deposited: at the securities firms where the bonds have been deposited.
  • Bondholders whose bonds have not been deposited: at Techcom Securities Company Limited on August 28, 2017. 

HOSE

Symbol Lookup

Close

Close